发明名称 SYSTEMS AND METHODS FOR FORMING SEMICONDUCTOR MATERIAL BY ATOMIC LAYER DEPOSITION
摘要 PURPOSE: Systems and methods for forming semiconductor materials by atomic layer deposition are provided to improve the production of III-V semiconductor materials by exactly controlling each thickness and composition of III-V semiconductor materials. CONSTITUTION: A manifold(104) includes a plurality of gas columns(108) which is composed to accept one or more gases through a port(110). The gas columns are placed to be vertically arranged each other to form manifold. A work piece substrate(112) is transferred through a space between an assembly(106) and the gas columns. Gas sources(114A,114B,114C,114D) supplies gases to gas ejectors(102A,102B,102C,102D). The gas sources include an external source of an III group element or a Vgroup element.
申请公布号 KR20120034031(A) 申请公布日期 2012.04.09
申请号 KR20110099281 申请日期 2011.09.29
申请人 SOITEC 发明人 WERKHOVEN CHRIS
分类号 H01L21/205;C23C16/455 主分类号 H01L21/205
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