| 摘要 |
<p>PURPOSE: A photo-sensitive resin composition is provided to maintain the essential characteristic of solder resist such as thermal resistance characteristic and electrical insulation reliability in addition to improve flexibility. CONSTITUTION: A photo-sensitive resin composition includes resin, a photo-polymerization initiator, an ultraviolet reactive acryl monomer, acryl polyol, and a thermal hardener. The resin is curable to ultraviolet ray and is capable of being developed in an alkali aqueous solution. The acryl polyol is polymer with monomer. The monomer is represented by chemical formula 1 and contains alcohol group in a molecule. The weight average molecular weight of the acryl polyol is between 3,000 and 100,000. In chemical formula 1, R1 is H or CH_3; R2 is C_aH_2a+1, and a is the integer of 1 to 12; and R3 is C_bH_2b, and b is the even number of 2 to 6. The resin includes at least one of resin manufactured by adding acid anhydride in bisphenolic epoxy resin. The thermal hardener includes blocked isocyanate.</p> |
