| 摘要 |
PURPOSE: A protective film for a semiconductor substrate is provided to enable smooth flip chip manufacturing process and to protect the surface of the substrate. CONSTITUTION: A protective film for a semiconductor substrate comprises a polyester substrate film(101), and an adhesive layer(102) coated with an acryl adhesive composition containing acryl polymer resin and aliphatic isocyanate hardener. The acryla polymer resin contains 0.01-0.9 weight parts of polymerization initiator based on 100 weight parts of acyl monomers. The acryl monomer is butylacrylate, 2-hydroxyethyl acrylate, methyl acrylate, or hydroxy butylacrylate.
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