发明名称 MANUFACTURING METHOD OF FILM FORMED SUBSTRATE, FILM FORMED SUBSTRATE, AND FILM FORMING APPARATUS
摘要 <p>PURPOSE: A method for manufacturing a film deposition substrate, a film deposition substrate, and a film deposition apparatus are provided to improve the adhesion between a Molybden layer and a glass substrate by depositing a second Molybden layer with a film on a surface of the first Molybden layer after depositing the first Molybden layer, containing a very small amount of oxygen, on the glass substrates with the film. CONSTITUTION: A back electrode layer(3) is formed on a glass substrate(2). The back electrode layer includes a first Molybden layer(3a) deposited on a surface of the glass substrates and a second Molybden layer(3b) deposited on the surface of the first Molybden layer. A CIGS(Copper Indium Gallium Selenide) layer(4) is formed on the second Molybden layer. A buffer layer(5) is formed on the CIGS layer. A transparent electrode layer(6) is formed on the buffer layer.</p>
申请公布号 KR20120034039(A) 申请公布日期 2012.04.09
申请号 KR20110099508 申请日期 2011.09.30
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 IWATA HIROSHI
分类号 H01L31/042;H01L31/0216;H01L31/18 主分类号 H01L31/042
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