| 摘要 |
<p>PURPOSE: A stacked semiconductor package is provided to reduce an overall package thickness by increasing the number of semiconductor chips mounted inside of a wiring board using an existing packaging process. CONSTITUTION: A cavity is formed on the center part of a first wiring board(110). The first wiring board comprises an upper wiring substrate(110a), a lower wiring substrate(110c), and a middle wiring board(110b). A first semiconductor chip group comprises a first semiconductor chip(120) and a second semiconductor chip(130) which is laminated on the first semiconductor chip. A first molding part(140) seals the cavity. A passive device(150) is included or mounted on the middle wiring board.</p> |
