| 摘要 |
PURPOSE: A wafer level mold formation method which uses glass fiber and a wafer structure using the same are provided to minimize the difference between thermal expansion coefficients of a wafer and a mold layer, thereby minimizing a bending phenomenon of a molded wafer. CONSTITUTION: A glass substrate(10) is attached to the lower part of a wafer(30) in which a semiconductor chip(40) is arranged. A liquid(50) for a mold is spread on a side surface of the upper part of the semiconductor chip. A glass fiber(60) is loaded on the semiconductor chip in which the liquid is spread. A mold layer is formed by compression molding of the liquid. The glass substrate is separated from the wafer. |
