| 摘要 |
A grinding device for plate-like bodies is provided with back pads which are configured in such a way as to adsorb and hold first surfaces of the principal surfaces of the plate-like bodies and with grinding pads which are configured in such a way as to be pressed against second surfaces of the aforementioned principal surfaces of the aforementioned plate-like bodies, thereby being ready to grind the aforementioned second surfaces. The aforementioned grinding device is characterized in that back pads located in the vicinity of areas outside the pertinent sides of the aforementioned plate-like bodies are heat-shrunk along the aforementioned sides and are forcibly brought into contact therewith. |
