| 摘要 |
A system and a method for managing a semiconductor package process are provided to automatically manage information of each process of the semiconductor package process, visually display the information of each process in real-time. The RFID tag(10) is attached to a magazine(2) for loading a substrate for at least one semiconductor package. The RFID reader(20) transceives an electric signal with the RFID tag and interprets the information received from the RFID tag. A host(30) processes the information received from the RFID tag and reader. The RFID tag normally performs a function even if an environment at 200°C is continued over 90 minutes. The RFID reader has a frequency band of 13.56 MHz(Mega Hertz), and is mounted to a die attach cure oven(4) and a wire bonder(5).
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