发明名称 |
CHEMICAL MECHANICAL POLISHING PAD WITH LIGHT STABLE POLYMERIC ENDPOINT DETECTION WINDOW AND METHOD OF POLISHING THEREWITH |
摘要 |
PURPOSE: A chemical-mechanical polishing pad which includes a light stability polymer end point detection window and a polishing method using the same are provided to analyze light projected on an optical sensor by passing the light stability polymer end point detection window after being reflected from the surface of a substrate, thereby easily determining a polishing end point. CONSTITUTION: A chemical-mechanical polishing pad comprises a light stability polymer end point detection window and an abrasive layer which has a polishing surface. The light stability polymer end point detection window comprises an ultraviolet absorber and/or a hindered amine light stabilizer. The light stability polymer end point detection window includes light stabilizer components of 0.1 to 5 weight percent. The light stability polymer end point detection window has initial double transmittance of 15 percent or greater with respect to light with a wavelength of 380nm. The light stability polymer end point detection window has negative time dependent strain.
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申请公布号 |
KR20120033261(A) |
申请公布日期 |
2012.04.06 |
申请号 |
KR20110097933 |
申请日期 |
2011.09.28 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
LOYACK ADAM;NAKATANI ALAN;KULP MARY JO;KELLY DAVID G. |
分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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