| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive resin composition that can form an adhesive layer not lowering adhesive force between a wiring layer and an adhesive layer even when repeatedly put in a high temperature circumstance. <P>SOLUTION: The coverlay film includes an adhesive layer and a film material for coverlay, wherein the adhesive layer is formed of an adhesive resin composition containing a siloxane-containing polyimide resin (A) having an ethylenically unsaturated double bond, and a bisphenol type vinylester resin (B). As the diamine component to be a raw material of the (A) component, siloxane diamine and an aromatic diamine having an ethylenically unsaturated double bond are contained; and the diamine to be used contains the siloxane diamine in a range of 75-96 mole based on 100 mole of all diamine component; and the (B) component is contained in a range of 25 pts.wt. or less based on 100 pts.wt. sum total of (A) component and (B) component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
