摘要 |
A vapor phase cooling apparatus (10): is provided with a heat receiving section (14a) that receives heat generated by an electronic component (50) by connecting the electronic component (50), which is a heat generating source, to the surface on the +Z side, which is a vertical exterior surface; has a housing (11) in which an interior space for storing a refrigerant is formed, and a first heat releasing part (21) and a second heat releasing part (22) that are positioned on the +Y side and the -Y side of the electronic component (50) and that release heat to the outside; and is characterized in that both ends of the first heat releasing part (21) and the second heat releasing part (22) in the X direction extend further along the surface on the +Z side than both ends of the heat receiving section (14a) in the X direction. |