SOLDERING PASTE AND FLUX

摘要

The purpose of the present invention is to provide a soldering paste that makes possible a surface mounting structure for electronic components that can withstand 1000 heat shock cycles of -40 - 150°C as required for use in the proximity of engines for vehicular applications without cracking in the solder joint parts. Flux containing an amine halogen salt and dicarboxylic acid is kneaded into a Sn-Ag-Bi-In alloy powder. As a result, a soldering paste with superior bondability and no cracking for 1000 heat shock cycles of -40 - 150°C that has long continuous printability and little occurrence of solder balls is obtained.