发明名称 |
METHOD FOR FORMING ELECTRIC COPPER PLATING FILM ON SURFACE OF RARE EARTH PERMANENT MAGNET |
摘要 |
<p>In order to address the problem of providing a novel method for forming an electric copper plating film with excellent adhesion on the surface of a rare earth permanent magnet, the method of the present invention is characterized by the immersion of a magnet in plating solution, followed by the application of 0.05A/dm2-4.0A/dm2 as the cathode current density for electric copper plating for 10-180 s, to commence processing.</p> |
申请公布号 |
WO2012043717(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
WO2011JP72366 |
申请日期 |
2011.09.29 |
申请人 |
HITACHI METALS, LTD.;KAMACHI MASANAO;YOSHIMURA KOSHI |
发明人 |
KAMACHI MASANAO;YOSHIMURA KOSHI |
分类号 |
H01F41/02;C25D7/00;C25D21/12;H01F1/053;H01F1/08 |
主分类号 |
H01F41/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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