SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce a quantity of pads by including an integration pad for integrating two or more pads which transmits/receives the same signal. CONSTITUTION: A first semiconductor chip(102) is mounted on one surface of a first substrate(100). A second semiconductor chip(122) is mounted on one surface of a second substrate(120). A plurality of first pads(110) is arranged on the first substrate. A plurality of second pads(126) is arranged on the second substrate. A connection pattern(130) respectively and electrically connects the first pad and the second pad which are facing to each other. A bonding wire(108) electrically connects the first semiconductor chip and the first substrate.