| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a chip inductor, which has electromagnetic wave-blocking function and flame-retardancy and can prevent fluidity from degrading. <P>SOLUTION: The epoxy resin composition contains an epoxy resin, a curing agent, a curing accelerator and an inorganic filler, wherein the epoxy resin composition contains: a soft ferrite as the inorganic filler; and a metal hydrate as a flame retardant, the metal hydrate being surface-treated with a silane coupling agent. The content of the soft ferrite in the resin composition is preferably 50-85 mass%; and aluminum hydroxide is preferably used as the metal hydrate. The electronic circuit with a built-in chip inductor is encapsulated by the epoxy resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
