| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently join a processed substrate to a support substrate and improve throughput of the joining processing. <P>SOLUTION: A joining system 1 has a carry-in/out station 2 carrying in and out a processed wafer W, a support wafer S, or a superposed wafer T to a joining processing station 3, and the joining processing station 3 performing predetermined processes on the processed wafer W and the support wafer S. The joining processing station 3 has: an application device 40 applying an adhesive to the processed wafer W; first thermal treatment devices 41 to 43 heating the processed wafer W to a first temperature; second thermal treatment devices 44 to 46 further heating the processed wafer W to a second temperature; turnover devices 34 to 37 turning over front and rear surfaces of the support wafer S; joining devices 30 to 33 joining the processed wafer W to the support wafer S; and a wafer transport area 60 transporting the processed wafer W, the support wafer S or the superposed wafer T to the each device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
