| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount a semiconductor element on a wiring board and the like, without generating short circuit failure to a narrow pitch. <P>SOLUTION: A semiconductor element 10 is equipped with a columnar connection terminal 15. The connection terminal 15 is formed so as to decrease a cross-sectional area of the connection terminal near a tip end 15a toward the tip end 15a. Particularly, the shape of the connection terminal 15 is a columnar except for a part near the tip end 15a, and a side surface 15b of the connection terminal is formed in a tapered shape at the part near the tip end 15a. On at least the side surface 15b formed in the tapered shape of the connection terminal 15, a metallic layer for improving solder wettability may be formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
