发明名称 IMPRINT METHOD, SEMICONDUCTOR INTEGRATED CIRCUIT MANUFACTURING METHOD, AND DROP RECIPE PREPARATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an imprint method, a semiconductor integrated circuit manufacturing method, and a drop recipe preparation method reducing fluctuation in the amount of residual film. <P>SOLUTION: A pattern imprinted on a substrate to be processed is inspected for defects to generate image data containing the defects. When a defect is detected, a defect contour is extracted from the generated image data, the extracted defect contour is reflected in the pattern data of a semiconductor integrated circuit, and a first drop recipe is prepared based on the pattern data which has the defect contour reflected therein. Then, the drop recipe used in applying coating of a hardening resin material is updated with the prepared first drop recipe. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012069701(A) 申请公布日期 2012.04.05
申请号 JP20100212672 申请日期 2010.09.22
申请人 TOSHIBA CORP 发明人 MATSUOKA YASUO;INENAMI RYOICHI;SANHONGI AKIKO
分类号 H01L21/027;B29C59/02 主分类号 H01L21/027
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