| 摘要 |
A semiconductor manufacturing apparatus 1 includes a wafer 10, a FOUP 20 that is a sealed container retaining the wafer 10 therein, an etching apparatus 30 that is a semiconductor processing apparatus, and an EFEM 40 that carries the wafer in a sealed condition between the FOUP and the etching apparatus. The FOUP includes a front door 20a, a sensor unit 21b detecting at least one of a temperature, a humidity, and a gas concentration, and a transmitter 25 that transmits information detected by the sensor unit. A receiver 31 receives information from the transmitter, and supplies the information to a purging unit 43. The purging unit performs purging until the temperature, etc., in the FOUP satisfies a reference value set beforehand. |
