TAPE CARRIER PACKAGE MANUFACTURING METHOD, AND METHOD OF MANUFACTURING FLEXIBLE CIRCUIT BOARD FOR TAPE CARRIER PACKAGE

摘要

An embodiment of the present invention relates to a tape carrier package manufacturing method wherein it is possible to solidly mount an electronic component with a short side length of 1.2mm or less on a connection terminal component of a flexible pattern of a flexible circuit board for a tape carrier package so as to have adequate tearing strength. Another embodiment of the present invention relates to a method of manufacturing a flexible circuit board for a tape carrier package, comprising the step of employing an optical automated inspection device to inspect a manufactured flexible circuit board for the tape carrier package, wherein a pigment employed in coloring an insulation film does not contain either chlorine atoms or bromine atoms, and wherein it is possible to keep deterioration in inspection efficiency caused by detection errors under control, and minimize the proportion of said flexible circuit boards for the tape carrier package found defective in inspection.