| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated heat radiation substrate in which the attachment force between a laminate binding layer and a base plate is relatively strong, and to provide an electronic assembly structure in which the heat radiation ability is relatively high. <P>SOLUTION: In the invention, the laminated heat radiation substrate and the electronic assembly structure using the laminated heat radiation substrate are provided. The laminated heat radiation substrate includes the base plate, a laminate binding layer, an insulation layer and a conductive layer. The laminated binding layer is arranged on the base plate and at least includes a first binding layer and a second binding layer. The first binding layer is arranged on the base plate. The second binding layer is arranged on the first binding layer. The insulation layer is arranged on the laminate binding layer. The conductive layer is arranged on the insulation layer. The electronic assembly structure includes the laminated heat radiation substrate and electronic parts. Among them, the insulation layer and the conductive layer form a storage space on the laminate binding layer and the laminate binding layer is exposed in the storage space. The electronic parts are arranged in the storage space and on the laminate binding layer and are electrically connected to the conductive layer. The electronic parts are preferably a light emission diode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
