| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat sink attachment structure which radiates heat of heat generating components mounted on an auxiliary board mounted on a mother board while securing an insulation distance with a space saving and inexpensive structure. <P>SOLUTION: A heat sink attachment structure includes an auxiliary board circuit part 10 which is composed of an auxiliary board 12, heat radiated components 11 mounted on the auxiliary board 12, a resin product 17 filling spaces around the heat radiated components 11 and achieving electrical insulation and heat conduction, and a heat sink 13 placed on the auxiliary board 12 through the resin product 17 and is mounted on the mother board. The resin product 17 has high viscosity and fixes the heat sink 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
