| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin filler which can enhance reliability of a substrate in the mounting temperature range or the thermal cycle temperature range of a semiconductor chip, or under high temperature/high humidity by reducing cure shrinkage when the hole of a package substrate for mounting a semiconductor is filled with resin and the resin is cured thereby reducing internal stress. <P>SOLUTION: The thermosetting resin filler contains a mixture epoxy resin containing a first epoxy resin which is liquid at 25°C and a second epoxy resin having an epoxy equivalent of 200 or more and having a viscosity of 2-100 Ps measured by a cone-plate viscometer at 25°C, 5 rpm, an epoxy resin hardener, and an inorganic filler. <P>COPYRIGHT: (C)2012,JPO&INPIT |
