发明名称 GRINDING METHOD AND GRINDING MACHINE
摘要 <P>PROBLEM TO BE SOLVED: To provide a grinding method and a grinding machine, in each of which the dropout of an abrasive grain is prevented and the roughness of a ground surface is kept below an allowable limit, so that the grinding work is achieved while prolonging the service life of an abrasive wheel. <P>SOLUTION: The length of a contact arc of the abrasive wheel 7, which is at the grinding work, with an object W to be ground is controlled to be the prescribed contact arc length, the amount of the abrasive grain of the abrasive wheel 7 to be projected from a bond layer is controlled to be equal to or smaller than a prescribed value, the retention force of the abrasive grain is controlled to be equal to or larger than a prescribed value, the thickness of a chip is controlled to be equal to or smaller than prescribed thickness and the grinding force to be exerted on the abrasive grain is controlled to be equal to or smaller than the retention force of the abrasive grain, so that the dropout of the abrasive grain is prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012066356(A) 申请公布日期 2012.04.05
申请号 JP20100214018 申请日期 2010.09.24
申请人 JTEKT CORP 发明人 YAMASHITA TOMOKAZU;SHINNO YASUO
分类号 B24B49/02;B24B5/00 主分类号 B24B49/02
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