MEMORY MODULE AND METHOD OF MANUFACTURING A MEMORY MODULE

摘要

A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.