ADHESIVE COMPOSITION AND FILM FOR PREPARING SEMICONDUCTOR

摘要

The present invention relates to an adhesive composition and film for preparing a semiconductor, and more specifically, an adhesive composition for preparing a semiconductor which comprises an acrylic resin containing acrylonitrile, a mixture of an epoxy compound and a phenolic resin, and a filler, having excellent wafer pick-up characteristics during a semiconductor manufacturing process, and has excellent adhesive strength to a wafer, a lead frame and a PCB substrate, and an adhesive film for preparing a semiconductor, containing a coating layer of the composition.