| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Bi-based Pb-free solder alloy for high temperature use which has excellent wettability and workability, and in which reaction with an Ni metallized layer in electronic parts and the like and Ni diffusion can be suppressed. <P>SOLUTION: The Pb-free solder alloy contains, by mass, 0.01 to 10% Sn, one or more kinds selected from Al and Cu by 0.03 to 1.0% in the case of Al and by 0.01 to 1.8% in the case of Cu, and 0 to 0.5% P, and the balance Bi with inevitable impurities. The Pb-free solder alloy can further contains one or more kinds selected from Ag and Zn by 0.01 to 3.0% in the case of Ag and by 0.01 to 0.4% in the case of Zn. <P>COPYRIGHT: (C)2012,JPO&INPIT |
