发明名称 SOLDERING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To obtain a jetting nozzle with which the stable solder jet is supplied and defective soldering is reduced without generating the withering of a flux about the jetting nozzle of a soldering device. <P>SOLUTION: The soldering device includes: a solder tank for storing a molten solder; a jetting nozzle which is arranged on the solder tank and the upper part of which is opened; and a circulating mechanism for supplying the molten solder stored in the solder tank to the jetting nozzle. The jetting nozzle has an outer wall with which the circumference is surrounded and a partition which is lower than the outer wall in the height and the upper end of the inside of the outer wall is covered with a belt-like member which is excellent in the wettability to the molten solder. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012066286(A) 申请公布日期 2012.04.05
申请号 JP20100213779 申请日期 2010.09.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWABATA RYOHEI;IDETA GORO
分类号 B23K1/08;B23K101/42;H05K3/34 主分类号 B23K1/08
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