| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a material having superior properties, such as an appropriate thermal expansion coefficient, fast thermal conduction, and light specific gravity, as a substitute material for ceramics or metals such as aluminum and copper to achieve efficient release of heat in a smaller area, which has become important in securing usage safety and product life in using LEDs and power semiconductors. <P>SOLUTION: A composite material based wiring board is proposed which substitutes a composite material 6 composed of carbon or silicon carbide, boron nitride, etc. and aluminum for a conventional metal consisting mainly of aluminum, thereby providing a suitable thermal expansion coefficient and further optimizing thermal transfer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
