| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonder which can prevent occurrence of a vacuum lead error due to thermal deformation of a substrate during the bonding, and to provide a bonding method. <P>SOLUTION: The die bonder which moves a semiconductor chip from a semiconductor wafer to be supplied and mounts the semiconductor chip on a substrate comprises a stage 30 which carries the substrate while absorbing and holding it, a bonding head 11 including a collet 130 which absorbs and holds the semiconductor chip at the tip, a horizontal movement mechanism which moves the bonding head in the horizontal direction while holding it, a vertical movement mechanism which moves the collet 130 in the vertical direction, and a hot air blowing device 20 (or a hot air blowing nozzle) which blows hot air to the surface of the substrate absorbed and held on the stage when the semiconductor chip is bonded onto the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
