| 摘要 |
<P>PROBLEM TO BE SOLVED: To automatically generate a coordinate data for attachment position of each component attached on a circuit board, using a gerber data that has been used when generating a print mask for printing solder on the pad of the circuit board. <P>SOLUTION: The coordinate data for attachment position of components is calculated by searching the attachment position of the components on a circuit board, by performing pattern matching for searching a form/array pattern of the pads of the circuit board that matches with the form/array pattern of terminals of the components, by using the pad information of gerber data that is used when generating a print mask for printing a solder on the pad of the circuit board as the pad information for the circuit board, which is then compared with the terminal information of part data of the components. The order of components for pattern matching is as follows: (1) BGA component on the lower surface of which a bump is provided; (2) a component with lead on a plurality of sides in which a plurality of sides have a lead; (3) component with lead on one side in which only one side has a lead; and (4) a chip component with no bump nor lead. <P>COPYRIGHT: (C)2012,JPO&INPIT |
