NON-CONTACT DETERMINATION OF JOINT INTEGRITY BETWEEN A TSV DIE AND A PACKAGE SUBSTRATE

摘要

A non-contact voltage contrast (VC) method of determining TSV joint integrity after partial assembly is provided. A TSV die is provided (101) including TSVs that extend from a front side of the TSV die to TSV tips on a bottom side of the TSV die. At least some TSVs (contacting TSVs) are attached to pads on a top surface of a multilayer (ML) package substrate. The ML package substrate is on a substrate carrier that blocks electrical access to the front side of the TSV die. Two or more nets including groups of contacting TSVs are tied common within the ML substrate. A charged particle reference beam is directed (102) to a selected TSV within a first net and a charged particle primary beam is then rastered (103) across the TSVs in the first net. VC signals emitted are detected (104), and joint integrity for the contacting TSVs to pads of the ML package substrate is determined (105) from the VC signals.