| 摘要 |
<p>A packaging structure of a light emitting diode (LED) light source module belongs to the field of the lighting device manufacturing. The packaging structure includes a base (11) with a reflector cup (15), at least one LED chip (12) is positioned on the bottom center of the reflector cup (15), and the chip (12) is bonded to the bottom of the reflector cup (15) by an insulation paste (13). The packaging structure is characterized in that a hard silica gel layer (17) is coated around the surface of the LED chip (12), a mixed layer (14) formed by a glue mixed with fluorescent powders is coated on the hard silica gel layer (17), and a positive and a negative poles are fetched out after the chips (12) are connected to each other by wirings (18).</p> |
