SEMICONDUCTOR STACK PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor stacked package and a manufacturing method thereof are provided to perform a molding process without restrictions on a scribe line width by extending a chip protection film. CONSTITUTION: A second semiconductor chip(C2) includes a through-electrode. A first semiconductor chip(C1) is laminated on the second semiconductor chip. A chip protection film(80) covers the upper surface of the first semiconductor chip. A molding layer(90) covers side surfaces of the second semiconductor chip and the first semiconductor chip. The molding layer is under-filled between the first semiconductor chip and the second semiconductor chip.