| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin filler in which its thixotropy is prevented from degrading with time and which is excellent in shape-retaining properties and abrasivity after filling a hole portion of a printed wiring board with the resin filler and curing it. <P>SOLUTION: The thermosetting resin filler comprises an epoxy resin, an epoxy resin-curing agent, an inorganic filler, and an aliphatic acid. The aliphatic acid is expressed by the general formula: (R<SB POS="POST">1</SB>COO)n-R<SB POS="POST">2</SB>(wherein substituent R<SB POS="POST">1</SB>is ≥5C hydrocarbon; substituent R<SB POS="POST">2</SB>is hydrogen, a metal alkoxide, or a metal; and n is 1 to 4). <P>COPYRIGHT: (C)2012,JPO&INPIT |
