| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of down-sizing a translucent substrate to reduce the cost. <P>SOLUTION: A semiconductor device has: a semiconductor element 10 having on one surface a light processing part 12, a circuit part 13, an electrode 14c arranged outside a first side of the circuit part, and electrodes 14f and 14g arranged outside a second side of the circuit part; a flexible substrate 20 having an opening 21b formed so as to be overlapped with the light processing part when seen in parallel to a normal line of the light processing part, and a wiring pattern 22 arranged on a first surface opposed to the one surface of the semiconductor element, and that is connected to the semiconductor element; a translucent substrate 30 connected to the flexible substrate so as to be overlapped with the opening when seen in parallel to the normal line; and a projection electrode 41 connecting the electrode with the wiring pattern. Seen in parallel to the normal line, the translucent substrate is arranged so as to be overlapped with respective electrodes. A length of the translucent substrate in a direction in which a third side 13c and a fourth side 13d of the circuit part are opposed to each other, is set to be shorter than a distance between the third side and the fourth side. <P>COPYRIGHT: (C)2012,JPO&INPIT |
