The invention relates to the use of a hot-melt adhesive having high hardness for bonding metal, paper and/or plastic films or foils. The invention further relates to a method for bonding a metal, paper and/or plastic film or foil to a substrate.
申请公布号
WO2012041838(A1)
申请公布日期
2012.04.05
申请号
WO2011EP66745
申请日期
2011.09.27
申请人
HENKEL AG & CO. KGAA;LOTZ, JUERGEN;KASPER, DIRK;PIELERT, LUTZ
