CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, POSITIVE ELECTRODE LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

The present invention provides a conductive adhesive composition that has superior adhesive properties and low surface resistance and is capable of use as a buffer layer foran electronic device. This conductive adhesive composition contains a water-soluble polyvinyl polymer (A), organic additive (B), and conductive high molecular weight organic compound (C). The organic additive (B) is at least one selected from water-soluble polyhydric alcohols, water-soluble pyrrolidones, or hydrophilic aprotic solvents. The conductive high molecular weight organic compound (C) is at least one selected from polyanilines, polypyrroles, or polythiophenes as well as derivatives thereof. Furthermore, the present invention provides an electronic device having a conductive layer formed from this conductive adhesive composition, a positive electrode laminate in which a conductive layer formed from this conductive adhesive composition is laminated, and a method for manufacturing this electronic device.