发明名称 |
NOVEL PHOTOSENSITIVE RESIN COMPOSITION PRODUCTION KIT, AND USE THEREOF |
摘要 |
<p>The present invention addresses the problem of providing a photosensitive resin composition: which has excellent storage ability after being stored for a long period of type; exerts excellent micromachining performance, developability, low-temperature curability, flexibility as a cured film, electrical insulation reliability, solder heat resistance, organic solvent resistance, and flame retardancy; and in which a substrate has little warpage after being cured. The abovementioned problem can be solved by using a photosensitive resin composition production kit containing two or more of agent A and agent B, wherein agent A contains a compound (A) having a carboxyl group, and agent B contains a compound (B) having a reactive group which reacts with a carboxyl group, an oxime ester photopolymerization initiator (C), and a compound (D) having a photosensitive group and not having a carboxyl group.</p> |
申请公布号 |
WO2012043001(A1) |
申请公布日期 |
2012.04.05 |
申请号 |
WO2011JP65211 |
申请日期 |
2011.07.01 |
申请人 |
KANEKA CORPORATION;KODA, TOMOHIRO;SEKITO, YOSHIHIDE;KOGISO, TETSUYA |
发明人 |
KODA, TOMOHIRO;SEKITO, YOSHIHIDE;KOGISO, TETSUYA |
分类号 |
G03F7/033;C08F2/50;C08G59/42;G03F7/004;G03F7/027;G03F7/031;H05K3/28 |
主分类号 |
G03F7/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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