发明名称 Verfahren zur Herstellung von Halbleitervorrichtungen mit bruchsicheren Schichten und Halbleitervorrichtung
摘要 1326947 Making semi-conductor devices INTEL CORP 14 Aug 1970 [22 Jan 1970] 39335/70 Heading H1K In the manufacture of a semi-conductor device a structure comprising a semi-conductor body bearing an abruptly-contoured insulating layer is treated to smooth the contours prior to the deposition on the contoured area of a further layer forming part of an electrical contact to the semi-conductor surface. The treatment consists in so heating a vitreous film at the contained area that plastic flow may occur to smooth the contours. Thus the insulating layer may be heated in the presence of glass-forming vaporous or deposited dopants, or the insulating layer may have a glass layer deposited thereon, or the layer may itself be vitreous or may itself enter a vitreous state when heated. The use of the method in the manufacture of a silicon IGFET with a polycrystalline silicon gate electrode is described.
申请公布号 DE2040180(A1) 申请公布日期 1971.07.29
申请号 DE19702040180 申请日期 1970.08.13
申请人 INTEL CORP. 发明人 E. MOORE,GORDON
分类号 H01L21/00;H01L21/3105;H01L21/336;H01L21/768;H01L23/29;H01L23/485;H01L23/522 主分类号 H01L21/00
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