TRANSFER APPARATUS AND PROCESSING SYSTEM

摘要

Provided are: a transfer apparatus wherein, by controlling the temperature distribution of a board material, throughput is not deteriorated, generation of warping of the board material is suppressed, and the board material is continuously and uniformly processed; and a processing system, which is provided with the transfer apparatus. A pick (18) provided in a common transfer chamber of the processing system has: an annular frame section (181) having a part thereof opened; three outer edge supporting sections (182), which are provided on the inner edge portion of the frame section (181) at equal intervals in the circumferential direction of the inner edge portion, such that the outer edge supporting sections protrude in the direction toward the center portion of the frame section (181), and which support the outer edge portion of a wafer (W); and a center-facing section (183), which has a disc-like shape, and faces the center portion of the wafer (W). The center-facing section (183) is connected to the center portion of the frame section (181) with a connecting section (184) having substantially an L-shape in side view, said center portion being in the circumferential direction. On the surface of the center-facing section (183), three supporting sections (185), which support the center portion of the wafer (W), are provided at equal intervals in the circumferential direction.