| 摘要 |
PURPOSE: A substrate bonding apparatus is provided to maintain the circular shape of an upper platen even the shape of a chamber is changed due to a pressure difference. CONSTITUTION: A lower chamber(30) forms a bonding area by being attached with an upper chamber(20). An upper platen(22) is fixed inside of the upper chamber and a first substrate is attached. A lower platen(32) is installed inside of the lower chamber and a second substrate is attached. A plurality of support bars(22a) is extended from the upper platen and installed in an inner wall insertion hole. A fixing member assembly restricts the movement of the support bar in the inside of the insertion hole.
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