| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which minimizes warpage of a sealing body where a semiconductor chip is covered with a mold resin. <P>SOLUTION: The manufacturing method of a semiconductor device includes a step for forming a first release layer 24 and a second release layer 25 in this order on the surface of a support 23, a step for forming a wiring layer 12 including a wiring pattern 17 on the surface of the second release layer 25, a step for stacking a plurality of semiconductor chips 11A-11D on the surface of a the wiring layer 12, a step for coating the surface of the wiring layer 12 including the plurality of semiconductor chips 11A-11D with a mold resin 22, a step for semi-curing the mold resin 22, a step for separating a sealing body 29 comprising the wiring layer 12, the plurality of semiconductor chips 11A-11D, and the mold resin 22 from the support 23 in this state, and a step for curing the mold resin 22 completely after the step for separating the sealing body 29 and the support 23. <P>COPYRIGHT: (C)2012,JPO&INPIT |
