| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily manufacture a light-emitting diode of high heat dissipation property. <P>SOLUTION: A first lead frame 111, a second lead frame 112, and an outside frame part are connected together by a connection part in one direction in two-dimension array, with no connection in the other direction which is vertical to that one direction. A reflection layer 12 is formed on a lead frame 11(100) in such shape as shown in figure 2(a)(reflection layer formation step). Then, as shown in figure 2(b), a light-emitting diode chip 13 is mounted on the second lead frame 112 being exposed inside a window part 121 (chip mounting step). Then, as shown in figure 2(c), a fluorescent material is packed inside the window part 121 under the condition, to form a fluorescent layer 15 (fluorescent layer formation step). Under that condition, cutting is made along vertical direction between laterally adjoining light-emitting diodes 10 (outside frame part cutting step). In the same way, cutting is made laterally between the light-emitting diodes 10 adjoining each other in vertical direction (connection part cutting step). <P>COPYRIGHT: (C)2012,JPO&INPIT |
