| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows for an external stress during press-fitting or other mounting. <P>SOLUTION: The semiconductor device includes a dished heat sink, a semiconductor element disposed in the dish portion of the heat sink, a lead pin attached on the semiconductor element, and a protection resin filling the dish portion of the heat sink so as to cover part of the lead pin and the semiconductor element. The lead pin comprises an attachment portion attached on the semiconductor element in an electrically connected state, a rod-like pin portion having a smaller diameter than that of the attachment portion, and an intermediate portion coupling the pin portion to the attachment portion and having a diameter intermediately between those of the attachment portion and the pin portion, and has a ratio of the diameter of the pin portion to the diameter of the intermediate portion in the range of 1:1.5 to 1:2.0. The lead pin also has a ratio of the length of the intermediate portion to the length of the pin portion plus the intermediate portion in the range of 1:2 to 1:4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
