| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a one part thermosetting resin composition that has short gelling time and high productivity when used in production of electronic parts etc., as an adhesive or a sealing agent. <P>SOLUTION: In the one part thermosetting resin composition, a first imidazole compound and a second imidazole compound, which are solid at ordinary temperature, but each of which has different chemical structure, are blended with an epoxy resin used as a base resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
