| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a structure which facilitates observation of the connection state of solder in an electronic apparatus in which connection lands formed on a first flexible substrate and connection terminals formed on a second flexible substrate are arranged to face each other and connected by means of solder. <P>SOLUTION: In the connection region of a connection terminals 3 formed on a second flexible substrate 1 and a connection lands 4, cuts 8 are provided in the sides of the connection terminals 3. With such a configuration, periphery of the cut 8 is observed through the second flexible substrate 1, and visual inspection of the molten state and fillet formation after solder connection can be carried out. <P>COPYRIGHT: (C)2012,JPO&INPIT |
