| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform exfoliation processing on a processed substrate and a support substrate appropriately and efficiently. <P>SOLUTION: An exfoliation device 30 includes: a first holding unit 110, having a heating mechanism 124 for heating a processed wafer W, for holding the processed wafer W; a second holding unit 111, having a heating mechanism 141 for heating a support wafer S, for holding the support wafer S; and a movement mechanism 150 having a first vertical movement unit 151 and a second vertical movement unit 152. The first vertical movement unit 151 holds the outer circumference portion of the second holding unit 111 and moves the second holding unit 111 in the vertical direction, so that the support wafer S held by the second holding unit 111 is continuously peeled off from the processed wafer W held by the first holding unit 110, in a direction from the outer circumference of the support wafer S toward the center portion thereof. <P>COPYRIGHT: (C)2012,JPO&INPIT |
