| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyolefin based adhesive tape for processing a semiconductor wafer excellent in anti-static property with less scraps produced during dicing. <P>SOLUTION: A sheet used as a base material of an adhesive tape for processing a semiconductor wafer contains a high molecular type anti-static agent of 5-30 wt.%, polyolefin based resin of 30-85 wt.%, and rubber-state elastic body of 10-40 wt.%. In the polyolefin based adhesive tape for processing the semiconductor wafer, the sheet is used as the base material and an adhesion layer is applied to one face of the sheet. <P>COPYRIGHT: (C)2012,JPO&INPIT |
