| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ball grid array (BGA) package that increases the routability of the package substrate and that increases device reliability. <P>SOLUTION: A routing technique for improving device reliability by selectively depopulating solder balls (and their respective solder ball pads 34, vias 32 and traces or lines 30) from a conventional foot print of a ball grid array (BGA) package, and a BGA package so modified. The routing technique uses the gap resulting from the depopulated solder balls as additional space for routing traces or lines from solder ball pads to an exterior surface of a substrate upon which a semiconductor die is mounted. An advantage of the present invention is that it permits the retention of an optimum via diameter while increasing the number of solder balls on the packages that continue shrinking, thereby increasing device reliability. <P>COPYRIGHT: (C)2012,JPO&INPIT |
